PK398 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 11.2247g

100% Material Declaration Data Sheet FF1156
PK398 (v1.2) March 29, 2013
Component
Silicon Die
Solder Bump
Die Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Substance
Description
CAS Number
or
Description
Percentage
of
Component
Doped silicon
7440-21-3
100.00
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
63.00
37.00
Bisphenol F-type liquid
epoxy resin
Phenolic resin
Bisphenol A-type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
9003-36-5
Trade secret
25068-38-6
Trade secret
60676-86-0
1333-86-4
Trade secret
15.00
15.00
5.00
5.00
54.00
1.00
5.000
Copper (Cu)
Nickel (Ni)
7440-50-8
7440-02-0
98.65
1.35
Organopolysiloxane
mixture
N/A
Copper
Nickel
Gold
Lead
Tin
Core
ABF
Solder mask
7440-50-8
7440-02-0
7440-57-5
7439-92-1
7440-31-5
NA
NA
N/A
100.00
37.54
0.61
0.19
0.48
0.83
44.54
15.70
0.11
Average Weight: 11.2247g
Use in Product
Silicon IC
Basis
Die to package
Basis
Basis
Component Weight/
Substance Weight
(grams)
0.77363
0.77363
0.258210
0.162672
0.095538
0.130000
Component
Percent of
Total
6.892
2.300
1.158
Basis
0.019500
Basis
0.019500
Basis
0.006500
Basis
Basis
Basis
Basis
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
0.006500
0.070200
0.001300
0.006500
4.989300
4.921944
0.067356
0.152000
0.152000
3.743
1.405000
0.023000
0.007000
0.018000
0.031000
1.667000
0.588000
0.004000
44.449
1.354
33.346
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PK398 (v1.2) March 29, 2013
www.xilinx.com
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