PK397 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 11.0927g

100% Material Declaration Data Sheet FFG1156
PK397 (v1.2) March 29, 2013
Component
Silicon Die
Solder Bump
Die Underfill
Heat Spreader
Substance
Description
Doped silicon
Tin (Sn)
Lead (Pb)
Bisphenol F-type liquid
epoxy resin
Phenolic resin
Bisphenol A-type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
Copper (Cu)
Nickel (Ni)
CAS Number
or
Description
7440-21-3
7440-31-5
7439-92-1
9003-36-5
Trade secret
25068-38-6
Trade secret
60676-86-0
1333-86-4
Trade secret
7440-50-8
7440-02-0
Percentage
of
Component
100.00
63.00
37.00
15.00
15.00
5.00
5.00
54.00
1.00
5.000
98.65
1.35
Heat Spreader
Adhesive
Substrate
Organopolysiloxane
mixture
Copper
Nickel
N/A
7440-50-8
7440-02-0
100.00
37.54
0.61
Average Weight: 11.0927g
Use in Product
Silicon IC
Basis
Die to package
Basis
Basis
Component Weight/
Substance Weight
(grams)
0.77363
0.77363
0.258210
0.162672
0.095538
0.130000
Component
Percent of
Total
6.974
2.328
1.172
Basis
0.019500
Basis
0.019500
Basis
0.006500
Basis
Basis
Basis
Basis
Main material
Main material
Main material
Main material
Main material
0.006500
0.070200
0.001300
0.006500
4.989300
4.921944
0.067356
0.152000
0.152000
3.743000
1.405000
0.023000
44.978
1.370
33.743
Gold
7440-57-5
0.19
Main material
0.007000
Lead
Tin
Core
ABF
Solder mask
7439-92-1
7440-31-5
NA
NA
N/A
0.48
0.83
44.54
15.70
0.11
Main material
Main material
Main material
Main material
Main material
0.018000
0.031000
1.667000
0.588000
0.004000
© Copyright 2011-2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK397 (v1.2) March 29, 2013
www.xilinx.com
1