PK394 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 3.188g

PK394 (v1.1) January 16,
2012
100% Material Declaration Data Sheet for
XC3S1400AN FGG676 Package
Component
Substance
Description
CAS# or
Description
Silicon Die
(FPGA)
Silicon Die
(PROM)
Die Attach
Material
Die To Die
Attach Film
Mold
Compound
Gold Wire
Solder Balls
Silicon
7440-21-3
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Epoxy resin
Phenol resin
Fused silica
Synthetic Rubber
60676-86-0
Fused silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Gold (Au)
Palladium
7440-57-5
7440-05-3
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
% of
Component
100.00
100.00
77.50
15.00
7.50
12.50
12.50
30.00
45.00
85.70
6.00
6.00
2.00
0.30
99.05
0.95
95.50
4.00
0.50
Use in Product
Average Weight: 3.188g
Component Weight/
Substance Weight
(in grams)
0.037750
0.037750
0.004100
0.004100
0.010100
0.007830
Component %
of Total
1.18
0.13
0.32
0.001520
0.000760
0.010100
0.001260
0.001260
0.003030
0.004550
1.430100
1.225600
0.085810
0.085810
0.028600
0.004290
0.022000
0.021790
0.000210
0.565470
0.540030
0.022620
0.002830
0.32
44.86
0.69
17.74
© Copyright 2006-2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK394 (v1.1) January 16, 2012
www.xilinx.com
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