PK386 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.524 g

100% Material Declaration Data Sheet CSG324
PK386 (v1.1) March 11, 2011
Component
Silicon Die
Die Attach
Material
Mold
Compound
Gold Wire
Solder Balls
Substrate
Substance
Description
CAS# or
Description
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Solid Epoxy Resin
Phenol Resin
Fused Silica
Metal Hydroxide
Carbon Black
Trade Secret
Trade Secret
60676-86-0
Trade Secret
1333-86-4
Gold
Palladium
7440-57-5
7440-05-3
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
Copper
Nickel
Gold
BT (core)
Solder mask
7440-50-8
7440-02-0
7440-57-5
21645-51-2/
7440-50-8/ Epoxy
resin
14807-96-6/
7727-43-7/ 7631-
86-9/ 34590-94-8/
85954-11-6
Average Weight: 0.524 g
% of
Component
Use in Product
100.00
Basis
77.50
15.00
Basis
Basis
Component Weight/
Substance Weight
(in grams)
0.022310
0.022310
0.007051
0.005465
0.001058
Component %
of Total
4.258
1.346
7.50
Basis
5.00
5.00
87.45
2.00
0.55
Basis
Basis
Basis
Basis
Basis
99.05
0.95
Basis
Basis
96.50
3.00
0.50
Basis
Basis
Basis
48.13
2.94
0.35
44.31
Basis
Basis
Basis
Basis
0.000529
0.216190
0.010810
0.010810
0.189058
0.004324
0.001189
0.007801
0.007727
0.000074
0.114184
0.110188
0.003426
0.000571
0.156464
0.075300
0.004598
0.000550
0.069324
41.258
1.489
21.791
29.860
4.28
Basis
0.006692
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included h0.erein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK386 (v1.1) March 11, 2011
www.xilinx.com
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