PK238 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.064 g

PK238 (v1.0) December 12, 2007
100% Material Declaration
Data Sheet
QFG32
Material Declaration Data Sheet
Component
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
External
Plating
Substance
Description
Silicon
Resin
Silver
Metal Oxide
Amine
Gamma
Butyrolactone
Resin
Silica
Copper
Iron
Phosporus
Zinc
Silver
Gold
Tin
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 0.064 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.00216
0.00216
0.00062
Component %
of Total
3.38 %
0.98%
Trade Secret
7440-22-4
N/A
68038-01-7
96-48-0
21.00
70.00
3.00
3.00
3.00
0.000131
0.000437
0.000019
0.000019
0.000019
Trade Secret
60676-86-0
7440-50-8
7439-89-5
7723-14-0
7440-66-6
16.00
84.00
97.50
2.35
0.03
0.12
7440-22-4
7440-57-5
100.00
100.00
0.02695
0.00431
0.02264
0.03254
0.031726
0.000765
0.000010
0.000039
0.000608
0.000608
0.00084
0.00084
0.00025
42.13%
50.86%
0.95%
1.32%
0.38%
7440-31-5
100.00
0.00025
PK238 (v1.0) December 12, 2007
www.xilinx.com
1
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