PK235 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.8477 g

PK235 (v1.0) December 12, 2007
100% Material Declaration
Data Sheet
FFG323
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Organopolysiloxane
mixture
Copper
Nickel
Gold
Glass fiber
Halogen fire retardant
BT (core)
Solder Mask
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
N/A
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
% of
Component
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.60
0.40
Average Weight: 2.8477 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.000010
0.000010
0.016860
0.010622
0.006238
0.056000
0.039200
0.011200
0.001680
0.003920
1.100000
1.095600
0.004400
0.031000
Component %
of Total
0.000%
0.592%
1.966%
38.627%
1.089%
100.00
0.031000
47.61
0.51
0.11
10.35
5.25
27.54
8.63
Metal Layer
Metal Layer
Metal Layer
1.343877
0.639826
0.006854
0.001478
0.139093
0.070500
0.370148
0.115978
0.300000
47.191%
10.535%
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
95.50
4.00
0.50
0.286500
0.012000
0.001500
PK235 (v1.0) December 12, 2007
www.xilinx.com
1
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