PK233 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 0.232g

PK233 (v1.1) July 29, 2011
100% Material Declaration Data Sheet FTG64
Component
Silicon Die
(FPGA)
Die Attach
Bonding Wire
Molding
Compound
Solder Balls
Substance
Description
CAS Number
or
Description
Silicon (Si)
Aluminium(Al)
Copper (Cu)
Tantalum (Ta)
7440-21-3
7429-90-5
7440-50-8
7440-25-7
Silver (Ag)
Epoxy Cresol Novolak
Diisobutyrate derivate
7440-22-4
29690-82-2
6846-50-0
Gold (Au)
7440-57-5
Biphenyl epoxy resin
Phenol resin
Quartz
Silica, vitreous
Carbon black
Antimony Trioxide
Brominated epoxy
resin (Halogen)
85954-11-6
9003-35-4
14808-60-7
60676-86-0
1333-86-4
1309-64-4
68541-56-0
Tin (Sn)
Silver (Ag)
Copper (Cu)
Nickel (Ni)
Lead (Pb)
7440-31-5
7440-22-4
7440-50-8
7440-02-0
7439-92-1
Percentage
of
Component
99.70
0.20
0.05
0.05
75.00
24.80
0.20
100.00
12.00
7.00
2.50
77.00
0.50
0.50
0.50
98.27
1.20
0.50
0.02
0.01
Use in Product
Silicon IC
Silicon IC
Silicon IC
Silicon IC
Glue
Glue
Glue
Wire
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Encapsulation
Base metal
Base metal
Base metal
Base metal
Impurity
Average Weight: 0.232g
Component Weight/
Substance Weight
(grams)
0.009340
0.009310
0.000020
0.000005
0.000005
0.001703
0.001280
0.000420
0.000003
0.000530
0.000530
0.147860
0.017740
0.010350
0.003700
0.113850
0.000740
0.000740
Component
Percent of Total
4.025
0.734
0.228
63.736
0.000740
0.016585
0.016300
0.000200
0.000080
0.000003
0.000002
7.149
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK233 (v1.1) July 29, 2011
www.xilinx.com
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