PK232 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.2450g

100% Material Declaration Data Sheet FT64
PK232 (v1.1) March 19, 2012
Component
Silicon Die
Die Attach
Mold
Compound
Solder Balls
Gold Wire
Substance
Description
CAS Number
or
Description
Percentage
of
Component
Silicon (Si)
Aluminum
7440-21-3
7429-90-5
Silver (Ag)
Epoxy Cresol Novolak
Dibutyl Phthalate
7440-22-4
29690-82-2
84-74-2
Biphenyl epoxy resin
Phenol Resin
Quartz
Silica, vitreous
Carbon Black
Antimony Trioxide
Brominated Epoxy
Resin
85951-11-6
9003-35-4
14808-60-7
60676-86-0
1333-86-4
1309-64-4
68541-56-0
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Gold (Au)
7440-57-5
99.96
0.04
75.00
24.80
0.20
12.00
7.00
2.50
77.00
0.50
0.50
0.50
63.00
37.00
100.00
Average Weight: 0.2450g
Use in Product
Component Weight/
Substance Weight
(grams)
0.009338
0.009334
0.000004
0.001018
0.000764
0.000252
0.000002
0.149487
0.017939
0.010464
0.003737
0.115106
0.000747
0.000747
Component
Percent of Total
3.81%
0.41%
61.01%
0.000747
0.017586
0.011079
0.006507
0.000837
0.000837
7.18%
0.34%
© Copyright 2008-2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK232 (v1.1) March 19, 2012
www.xilinx.com
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