PK230 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.3658 g

PK230 (v1.0) November 27, 2007
100% Material Declaration
Data Sheet
CS484
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Mold
Compound
Laminate
Wire
Solder Balls
Silicon
Resin
Silver
Resin
SiO2
Laminate
Solder Mask
Copper
Nickel
Gold
Gold
Tin
Lead
CAS# or
Description
7440-21-3
7440-22-4
% of
Component
100.00
22.00
78.00
Average Weight: 1.3658 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.0724
0.0724
0.0073
0.0016
0.0057
0.4473
Component %
of Total
5.30%
0.53%
32.75
60676-86-0
N/A
N/A
7440-50-8
7440-02-0
7440-57-5
7440-57-5
7440-31-5
7439-92-1
12.00
88.00
Metal Layer
Metal Layer
Metal Layer
Metal Layer
63.00
37.00
0.0537
0.3936
0.5963
0.3159
0.0346
0.2309
0.0126
0.0023
0.0122
0.0122
0.2303
0.1451
0.0852
43.86%
0.89%
16.86%
PK230 (v1.0) November 27, 2007
www.xilinx.com
1
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