PK229 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 5.6330 g

PK229 (v1.0) September 24, 2007
100% Material Declaration
Data Sheet
FF665
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Organopolysiloxane
mixture
Cu
Ni
Au
Glass fiber
Halogen fire retardant
BT (core)
Solder mask
Tin
Lead
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
N/A
7440-50-8
7440-02-0
7440-57-5
NA
NA
NA
NA
7440-31-5
7439-92-1
% of
Component
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.60
0.40
100.00
46.91
0.52
0.12
10.50
5.25
28.00
8.70
63.00
37.00
Average Weight: 5.6330 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.322090
0.322090
0.018510
0.011661
0.006849
0.056000
0.039200
0.011200
0.001680
0.003920
2.800000
2.788800
0.011200
0.062000
Component %
of Total
5.718%
0.329%
0.994%
49.707%
1.101%
0.062000
metal layer
metal layer
metal layer
1.818880
0.853237
0.009458
0.002183
0.190982
0.095491
0.509286
0.158243
0.555520
0.3499776
0.2055424
32.290%
9.862%
PK229 (v1.0) September 24, 2007
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