PK228 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.0811 g

PK228 (v1.0) August 15, 2007
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Silicon
7440-21-3
Epoxy resin(EP)
Silver
Misc.
19690-82-2
7440-22-4
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
Copper
Iron
Phosphorus
Zinc
Silver
Gold
Tin
Trade secret
60676-86-0
1333-86-4
Trade secret
Trade secret
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-57-5
7440-31-5
100% Material Declaration
Data Sheet
SOG8
Material Declaration Data Sheet
% of
Component
100.00
Average Weight: 0.0811 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.003961
0.003961
0.00124
Component %
of Total
4.88%
1.53%
21.00
70.00
9.0
(Metal oxide,
amine, gamma
butyrolactone)
0.0002604
0.000868
0.0001116
0.041769
51.45%
7.50
86.00
0.50
2.00
0.003133
0.035922
0.000209
0.000835
4.00
97.50
2.35
0.03
0.12
0.001671
0.031983
0.031184
0.000752
0.000009
0.000038
0.000559
39.36%
0.69%
100.00
100.00
100.00
0.000559
0.000223
0.000223
0.001364
0.001364
0.27%
1.82%
PK228 (v1.0) August 15, 2007
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1
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