PK226 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :9.7816g

100% Material Declaration Data Sheet for Virtex-5 FFG1136
PK226 (v1.1) Apr 14, 2016
Component
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader Adhesive
Solder Ball
Substrate
Substance Description
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Organopolysiloxane mixture
Tin
Silver
Copper
Copper
Tin
Lead
Silver
Core
PP
ABF
Solder Mask
CAS # or Description
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
N/A
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
N/A
Average Weight :
9.7816
g
% of Component Use in product
100.000
63.000
37.000
70.000
20.000
3.000
7.000
99.600
0.400
100.000
95.500
4.000
0.500
32.09
1.07
0.14
0.08
44.57
5.20
14.59
2.26
Component Weight
0.535760
0.535760
0.032320
0.020362
0.011958
0.026500
0.018550
0.005300
0.000795
0.001855
4.800000
4.780800
0.019200
0.185000
0.185000
0.948980
0.906276
0.037959
0.004745
3.253040
1.043879
0.034944
0.004627
0.002491
1.449800
0.169143
0.474568
0.073589
Component % of total
5.477%
0.330%
0.271%
49.072%
1.891%
9.702%
33.257%
Revision History
Date
08/06/2007
04/14/2016
Version
1.0
1.1
Description of Revisions
Initial Xilinx release
Update substrate
Notice of Disclaimer
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© Copyright 2016 Xilinx