PK222 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :5.633g

100% Material Declaration Data Sheet for Virtex-5 FFG665
PK222 (v1.1) Apr 14, 2016
Component
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader Adhesive
Solder Ball
Substrate
Substance Description
Silicon
Tin
Lead
CAS # or Description
7440-21-3
7440-31-5
7439-92-1
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
60676-86-0
9003-36-5
25068-38-6
19900-65-3
Copper
Nickel
7440-50-8
7440-02-0
Organopolysiloxane mixture N/A
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
Copper
Tin
Lead
Silver
Core
ABF
Solder Mask
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
Average Weight :
5.633
g
% of Component Use in product
100.000
63.000
37.000
Component Weight
0.322090
0.322090
0.018510
0.011661
0.006849
Component % of total
5.718%
0.329%
70.000
20.000
3.000
7.000
0.056000
0.039200
0.011200
0.001680
0.003920
0.994%
99.600
0.400
2.800000
2.788800
0.011200
49.707%
100.000
0.062000
0.062000
1.101%
95.500
4.000
0.500
0.555520
0.530522
0.022221
0.002778
9.862%
49.91
0.81
0.12
0.02
32.67
13.00
3.46
metal layer
metal layer
metal layer
1.818880
0.907803
0.014733
0.002183
0.000364
0.594228
0.236454
0.062933
32.290%
Revision History
Date
09/06/2007
04/14/2016
Version
1.0
1.0
Description of Revisions
Initial Xilinx release
Update substrate
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable
environmental laws and regulations. Xilinx subcontracts the production, test and assembly of
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All data provided hereunder is based on information received from Contractors. Xilinx has not
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solely for your reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx