PK217 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 10.243 g

PK217 (v1.0) February 20, 2007
100% Material Declaration
Data Sheet
BGG560
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Dam
Laminate
Heat Spreader
Heat Spreader
Adhesive
Gold Wire
Solder Balls
Silicon
Resin
Silver
Resin
Silica
Resin
Silica
BT (core)
Solder Mask (EP)
Copper
Nickel
Gold
Copper
Iron
Phosphorus
Zinc
Nickel
Gold
Tin
Silver
Copper
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 10.243 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.2814
0.2814
0.0227
Component %
of Total
2.75%
0.22%
Trade Secret
7440-22-4
25.00
75.00
0.005675
0.017025
0.5334
5.21%
Trade Secret
60676-86-0
Trade Secret
60676-86-0
Trade Secret
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-50-8
7439-89-6
7723-14-0
7440-66-6
26.00
74.00
Filler
28.00
72.00
Filler
Metal Layer
Metal Layer
Metal Layer
97.50
2.35
0.03
0.12
0.138684
0.394716
0.0138
0.003864
0.009936
0.8314
0.509
0.180
0.129
0.010
0.003
7.2427
7.062
0.170
0.002
0.009
0.329
0.13%
8.12%
70.71%
3.21%
7440-02-0
74410-57-5
7440-31-5
7440-22-4
7440-50-8
100.00
100.00
95.50
4.0
0.5
0.0329
0.0236
0.0236
0.9648
0.921
0.039
0.005
0.23%
9.42%
PK217 (v1.0) February 20, 2007
www.xilinx.com
1
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