PK215 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 16.2810 g

PK215 (v1.0) January 17, 2007
100% Material Declaration
Data Sheet
FF1738
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Sink
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Phenolic Resin
Carbon Black
Additive
Copper
Nickel
Organopolysiloxane
mixture
Copper
Nickel
Gold
Glass fiber
Halogen fire retardant
BT (CORE)
Solder Mask
Tin
Lead
7440-21-3
7440-31-5
7439-92-1
60676-86-0
25068-38-6
9003-36-5
9003-35-4
1333-86-4
2530-83-8
7440-50-8
7440-02-0
N/A
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7439-92-1
% of
Component
100.00
63.00
37.00
54.50
2.50
25.00
15.0
0.50
2.50
99.60
0.40
Average Weight: 16.2810 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.004160
0.004160
0.032250
0.020318
0.011933
0.100000
0.054500
0.002500
0.025000
0.015000
0.000500
0.002500
7.350000
7.320600
0.029400
0.260000
Component %
of Total
0.026%
0.198%
0.626%
45.145%
1.597%
10.00
0.260000
46.49
0.52
0.11
10.40
5.32
28.56
8.60
Metal Layer
Metal Layer
Metal Layer
63.00
37.00
6.884300
3.200511
0.035798
0.007573
0.715967
0.366245
1.966156
0.592050
1.650290
1.039683
0.610607
42.284%
10.136%
PK 215 (v1.0) January 17, 2007
www.xilinx.com
1
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Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.