PK213 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 28.511 g

PK213 (v1.0) October 18, 2006
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Heat Slug
Ext. Heat Sink
plating
Bond Wire
Ext. Plating
Silicon
Silver
Epoxy (EP)
Epoxy Resin (EP)
Silica
Copper
Nickel
Silicon
Magnesium
Silver
Copper
Nickel
Gold
Tin
Lead
100% Material Declaration
Data Sheet
HQ304
Material Declaration Data Sheet
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 28.511 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.15449
0.15449
0.01427
Component %
of Total
0.58%
0.05%
7440-22-4
Trade Secret
75.00
25.00
0.010699
0.003566
7.45805
28.13%
Trade Secret
60676-86-0
7440-50-8
15.00
85.00
96.20
3.00
0.65
0.15
1.118708
6.339344
0.90153
0.867270
0.027046
0.005860
0.001352
0.00155
3.40%
0.01%
7440-22-4
7429-50-8
100.00
100.00
0.00155
17.87660
17.87660
0.01157
67.43%
0.04%
7440-02-0
7440-57-5
7440-31-5
7439-92-1
100.00
100.00
85.00
15.00
0.01157
0.01231
0.01231
0.05572
0.047361
0.008358
0.05%
0.21%
PK213 (v1.0) October 18, 2006
www.xilinx.com
1
© 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
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Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.