PK212 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.099 g

PK212 (v1.0) October 5, 2006
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
Epoxy (EP)
Silver
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Bismuth
Copper
Iron
Phosphorus
Zinc
Silver
Gold
Tin
100% Material Declaration
Data Sheet
QFG48
Material Declaration Data Sheet
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 0.099 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.003168
0.003168
0.0008019
Component %
of Total
3.20%
0.81%
Trade Secret
7440-22-4
23.00
77.00
0.000184437
0.000617463
0.0383328
38.72%
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
9.00
7.00
0.50
82.50
1.00 max
7440-50-8
7439-89-6
7723-14-0
7440-66-6
97.50
2.35
0.03
0.12
0.003449952
0.002683296
0.000191664
0.03162456
0.000383328
0.0543411
0.0529825725
0.00127701585
0.00001630233
0.00006520932
0.0011286
54.89%
1.14%
7440-22-4
7440-57-5
7440-31-5
100.00
100.00
100.00
0.0011286
0.0008613
0.0008613
0.0003663
0.0003663
0.87%
0.37%
PK212 (v1.0) October 5, 2006
www.xilinx.com
1
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