PK210 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.5607 g

100% Material Declaration Data Sheet SOG20
PK210 (v1.1) June 17, 2011
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Lead Frame
Lead Frame
Plating
Gold Wire
External
Plating
Silicon (Si)
7440-21-3
Resin
Silver (Ag)
Metal oxide
Amine
Gamma
Butyrolactone
Trade Secret
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Silica Fused
Epoxy Resin (EP)
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
60676-86-0
Trade secret
Trade secret
29690-82-2
Trade secret
Copper (Cu)
Iron (Fe)
Phosphorus (P)
Zinc (Zn)
7440-50-8
7439-89-6
7723-14-0
7740-66-6
Silver (Ag)
7440-22-4
Gold (Au)
7440-57-5
Tin (Sn)
7440-31-5
% of
Component
100.00
21.00
70.00
3.00
3.00
3.00
86.00
7.50
0.50
2.00
4.00
97.50
2.35
0.03
0.12
100.00
99.05
100.00
Average Weight: 0.5607 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.019350
0.019350
0.003350
0.000704
0.002345
0.000101
0.000101
0.000101
0.369890
0.318105
0.027742
0.001849
0.007398
0.014796
0.161900
0.157853
0.003805
0.000049
0.000194
0.001740
0.001740
0.000770
0.000770
0.003690
0.003690
Component %
of Total
3.451
0.597
65.971
28.875
0.310
0.137
0.658
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included h0.erein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK210 (v1.1) June 17, 2011
www.xilinx.com
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