PK208 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.50052 g

PK208 (v1.0) October 5, 2006
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
7440-21-3
Siliver
Epoxy (EP)
Anhydride
7440-22-4
Trade Secret
Trade Secret
Epoxy Resin (EP)
Silica
Trade Secret
60676-86-0
Copper
Nickel
Silicon
Magnesium
7440-50-8
7440-02-0
7440-21-3
7440-95-4
Silver
Gold
Tin
7440-22-4
7440-57-5
7440-31-5
100% Material Declaration
Data Sheet
PQG44
Material Declaration Data Sheet
% of
Component
100.00
Average Weight: 0.50052 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.01411
0.01411
0.00352
Component %
of Total
2.81%
0.70%
70.00
20.00
10.00
0.002467
0.000705
0.000352
0.34915
69.67%
15.00
85.00
98.20
3.00
0.65
0.15
0.052373
0.296778
0.12312
0.118444
0.003694
0.00800
0.000185
0.001440
24.57%
0.29%
100.00
100.00
100.00
0.001440
0.00101
0.00101
0.00817
0.00817
0.20%
1.76%
PK208 (v1.0) October 5, 2006
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