PK206 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.68104 g

PK206 (v1.0) October 5, 2006
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
7440-21-3
Resin
Silver
Trade secret
7440-22-4
Silica
Epoxy Resin (EP)
Carbon black
Epoxy Cresol
Novolac
Phenol Resin
60676-86-0
Trade Secret
Trade Secret
29690-82-2
Trade Secret
Copper
Iron
Phosphorus
Zinc
7440-50-8
7439-89-6
7723-14-0
7440-66-6
Silver
Gold
Tin
7440-22-4
7440-57-5
7440-31-5
100% Material Declaration
Data Sheet
PCG20
Material Declaration Data Sheet
% of
Component
100.00
Average Weight: 0.68104 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.00538
0.00538
0.00193
Component %
of Total
0.79%
0.28%
25.00
75.00
0.000482
0.001445
0.47584
69.88%
86.00
7.50
0.50
2.00
0.409223
0.035688
0.002379
0.009517
4.00
97.50
2.35
0.03
0.12
0.019034
0.18640
0.181738
0.004380
0.000056
0.000224
0.00083
27.37%
0.12%
100.00
100.00
100.00
0.00083
0.00056
0.00056
0.01010
0.01010
0.08%
1.48%
PK206 (v1.0) October 5, 2006
www.xilinx.com
1
© 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.