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PK203 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.6385 g
PK203 (v1.0) October 5, 2006
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Laminate
Gold Wire
Solder Balls
Silicon
Resin
Silver
Resin
Silica
Copper
Nickel
Gold
Board
Solder Mask (EP)
Gold
Tin
Lead
100% Material Declaration
Data Sheet
CS280
Material Declaration Data Sheet
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 0.6385 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.0253
0.0253
0.0033
Component %
of Total
3.97%
0.51%
Trade Secret
7440-22-4
22.00
78.00
0.0007
0.0025
0.2890
45.25%
Trade Secret
60676-86-0
7440-50-8
7440-02-0
7440-57-5
Trade Secret
Trade Secret
7440-57-5
7440-31-5
7439-92-1
12.00
88.00
16.72
4.41
0.79
63.62
14.46
Metal Layer
Metal Layer
Metal Layer
100.00
63.00
37.00
0.0347
0.2543
0.1770
0.0296
0.0078
0.0014
0.1126
0.0256
0.0107
0.0107
0.1332
0.0839
0.0493
27.73%
1.68%
20.86%
PK203 (v1.0) October 5, 2006
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Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.