PK196 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 7.032g

PK196 (v1.0.1) January 8, 2007
100% Material Declaration
Data Sheet
BGG352
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Dam
Laminate
Heat Sink
Heat Sink
Plating
Gold Wire
Solder Balls
Silicon
Resin
Silver
Resin
Silica
Proprietary
Silica
Copper
Nickel
Gold
Board
Solder Mask (EP)
Copper
Nickel
Gold
Tin
Silver
Copper
CAS# or
Description
7440-21-3
% of
Component
100.00
Use in Product
Average Weight: 7.032g
Component Weight/
Substance Weight
(in grams)
0.0291
0.0291
0.004
Component %
of Total
0.41%
0.05%
Trade Secret
7440-22-4
25.00
75.00
0.001
0.003
0.2374
3.38%
Trade Secret
60676-86-0
Trade Secret
60676-86-0
7440-50-8
7440-02-0
7440-57-5
Trade Secret
Trade Secret
7440-50-8
26.00
74.00
27.00
73.00
Metal Layer
Metal Layer
Metal Layer
100.00
0.062
0.176
0.0088
0.002376
0.006424
0.647
0.101
0.006
0.002
0.396
0.142
5.252
5.252
0.2243
0.12%
9.06%
74.85%
3.19%
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
100.00
100.00
95.50
4.00
0.50
0.2243
0.0224
0.0224
0.606
0.579
0.024
0.003
0.32%
8.62%
PK196 (v1.0.1) January 8, 2007
www.xilinx.com
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