PK193 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 5.7254g

PK193 (v1.1) July 06, 2009
Component
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Substance
Description
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper (Cu)
Nickel (Ni)
Organopolysiloxane
mixture
Copper
Nickel
Gold
Halogen fire retardant
Glass Fiber
BT (core)
Solder Mask (EP)
Tin
Lead
100% Material Declaration Data Sheet: FF676
CAS Number
or
Description
Percentage of
Component
7440-21-3
100
7440-31-5
63
7439-92-1
37
60676-86-0
70
9003-36-5
20
25068-38-6
3
19900-65-3
7
7440-50-8
7440-02-0
99.60
0.40
N/A
100
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7439-92-1
46.91
0.52
0.12
5.25
10.5
28
8.7
63
37
Average Weight: 5.7254g
Use in
Product
Component Weight/
Substance Weight
(grams)
0.21084
Component
Percent of Total
3.683%
0.21084
0.01131
0.197%
0.00712
0.00418
0.03300
0.576%
0.02310
0.00660
0.00099
0.00231
2.90000
50.652%
2.88840
0.01160
0.03000
0.524%
0.03000
Metal Layer
Metal Layer
Metal Layer
1.07000
0.50194
0.00556
0.00128
0.05618
0.11235
0.29960
0.09309
1.47024
0.92625
0.54399
18.689%
25.679%
© 2006–2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other
countries. All other trademarks are the property of their respective owners.
PK193 (v1.1) July 06, 2009
www.xilinx.com
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