PK192 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :10.5305g

100% Material Declaration Data Sheet for Virtex-5 FFG1153
PK192 (v1.3) Apr 14,
2016
Component
Silicon Die
Substance Description
Si
Solder Bump
Sn
Pb
Underfill
Bisphenol F/ epichlorohydrin copolymer
Phenolic resin
Bisphenol A type liquid epoxy resin
Amine type accelerator
Silicon dioxide
Carbon black
Additives
Sn
Solder paste
Ag
Cu
Capacitor 1
Ceramic(BaTiO3 type)
Inner Electrode(Ni)
Outer Electrode(Cu)
Plating1(Ni)
Plating2(Sn)
Capacitor 2
Ceramic(BaTiO3 type)
Inner Electrode(Ni)
Outer Electrode(Cu)
Plating1(Ni)
Plating2(Sn)
Heat sink
Cu
Ni
Heat sink adhesive
Aluminum oxide(Al2O3)
Zinc oxide (ZnO)
Silicone
Additives
Solder ball
Substrate
Sn
Ag
Cu
Copper
Tin
Lead
Silver
Core
PP
ABF
Solder Mask
Average Weight : 10.5305 g
CAS # or Description
7440-21-3
7440-31-5
7439-92-1
9003-36-5
trade secret
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
7440-31-5
7440-22-4
7440-50-8
trade secret
7440-02-0
7440-50-8
7440-02-0
7440-31-5
trade secret
7440-02-0
7440-50-8
7440-02-0
7440-31-5
7440-50-8
7440-02-0
1344-28-1
1314-13-2
Trade Secret
Trade Secret
% of component Use in product
100.00
basis
63.00
37.00
basis
basis
20.00
15.00
5.00
5.00
51.50
1.00
2.50
basis
basis
basis
basis
basis
basis
Additive
96.50
3.00
0.50
metal
metal
metal
61.80
27.00
9.90
0.40
0.90
Ceramic
Inner electrode
Out electrode
Plating1
Plating2
61.54
18.21
17.95
0.77
1.54
Ceramic
Inner electrode
Out electrode
Plating1
Plating2
99.54
0.46
Main material
Main material
70.00
15.00
15.00
Main material
Main material
Main material
Additive
Component weight
0.548912
0.548912
0.041809
0.026340
0.015469
0.065000
0.013000
0.009750
0.003250
0.003250
0.033475
0.000650
0.001625
0.070000
0.067550
0.002100
0.000350
0.028000
0.017304
0.007560
0.002772
0.000112
0.000252
0.093600
0.057600
0.017040
0.016800
0.000720
0.001440
4.965400
4.942559
0.022841
0.152000
0.106400
0.022800
0.022800
Component % of total
5.213%
0.397%
0.617%
0.665%
0.266%
0.889%
47.153%
1.443%
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
N/A
95.50
4.00
0.50
43.30
0.92
0.13
0.06
37.26
4.35
12.20
1.78
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
0.965783
0.922323
0.038631
0.004829
3.600000
1.558800
0.033120
0.004680
0.002160
1.341360
0.156600
0.439200
0.064080
9.171%
34.186%
Revision History
Date
05/19/2010
03/04/2011
03/29/2013
04/14/2016
Version
1.0
1.1
1.2
1.3
Description of Revisions
Initial Xilinx release.
Update component weights
Updated Substrate
Component
Update substrate
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable
environmental laws and regulations. Xilinx subcontracts the production, test and assembly of
hardware devices to independent third-party vendors and materials suppliers (“Contractors”).
All data provided hereunder is based on information received from Contractors. Xilinx has not
independently verified the accuracy or completeness of this information which is provided
solely for your reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx