PK191 Datasheet, PDF (1/3 Pages) –

100% Material Declaration Data Sheet FF1153
PK191 (v1.2) March 29, 2013
Component
Silicon Die
Solder Bump
Die Underfill
Solder Paste
Substrate
Substance
Description
Doped silicon
Tin (Sn)
Lead (Pb)
Bisphenol F-type
liquid epoxy resin
Phenolic resin
Bisphenol A-type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
Tin (Sn)
Silver (Ag)
Copper (Cu)
Copper (Cu)
Nickel (Ni)
Gold (Au)
Lead (Pb)
Tin (Sn)
Core
ABF
Solder Mask
CAS Number
or
Description
Percentage
of
Component
7440-21-3
7440-31-5
7439-92-1
100.00
63.00
37.00
9003-36-5
Trade secret
25068-38-6
20.00
15.00
5.00
Average Weight: 10.6621 g
Use in Product
Silicon IC
Die to package
Component Weight/
Substance Weight
(grams)
0.548912
0.548912
0.041809
0.026340
0.015469
0.065000
Component
Percent of Total
5.148
0.392
0.610
Basis
0.013000
Basis
0.009750
Basis
0.003250
Trade secret
60676-86-0
1333-86-4
Trade secret
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-02-0
7440-57-5
7439-92-1
7440-31-5
N/A
N/A
N/A
5.00
51.50
1.00
2.50
96.50
3.00
0.50
35.00
0.44
0.10
0.49
0.83
53.64
8.56
0.94
Basis
Basis
Basis
Basis
Basis
Basis
Basis
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
0.003250
0.033475
0.000650
0.001625
0.070000
0.067550
0.002100
0.000350
3.600000
1.260108
0.015963
0.003458
0.017562
0.029903
1.930681
0.308092
0.034232
0.657
33.764
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PK191 (v1.2) March 29, 2013
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