PK189 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :22.9881g

100% Material Declaration Data Sheet for FF1760
PK189 (v1.2) September 20, 2016
Component
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader Adhesive
Solder Ball
Substrate
Substance Description
CAS # or Description
Average Weight :
22.9881
g
% of Component Use in product Component Weight Component % of total
Silicon
Tin (Sn)
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Organopolysiloxane mixture
Tin
Lead
Copper
Tin
Lead
Silver
BT (Core)
ABF
Solder Mask
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
N/A
7440-31-5
7439-92-1
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
100.000
63.000
37.000
70.000
20.000
3.000
7.000
99.900
0.100
100.000
63.000
37.000
49.51
0.72
0.14
0.02
34.75
12.42
2.44
1.039000
1.039000
0.051269
0.032299
0.018969
0.105000
0.073500
0.021000
0.003150
0.007350
11.000000
10.989000
0.011000
0.180000
0.180000
1.662824
1.047579
0.615245
8.950000
4.431145
0.064440
0.012530
0.001790
3.110125
1.111590
0.218380
4.520%
0.223%
0.457%
47.851%
0.783%
7.233%
38.933%
Revision History
The following table shows the revision history for this document.
Date
08/06/07
09/21/12
09/20/16
Version
1.0
1.1
1.2
Description of Revisions
Initial Xilinx release.
Updated CAS # of Pb (7439-92-1) in Solder Ball.
Updated Substrate substances description and weights.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable
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© Copyright 2016 Xilinx