PK185 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 18.0000 g

PK185 (v1.0) September 21, 2006
100% Material Declaration
Data Sheet
BFG957
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Chromium
Silica and other filler
materials
Polymetric Resin
Silane compound
Copper
Nickel
Gold
Glass Fiber
Halogen Fire
Retardant
BT (core)
Solder Mask
Tin
Ag
Copper
CAS# or
Description
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-47-3
Proprietary
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7440-02-0
7440-50-8
% of
Component
100.00
63.00
37.00
70.00
20.00
3.00
7.00
98.00
2.00
Average Weight: 18.0000 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0425830
0.425830
0.010000
0.006300
0.03700
0.071000
0.049700
0.014200
0.002130
0.004970
11.000000
10.780000
0.220000
0.085000
Component %
of Total
2.366%
0.056%
0.394%
61.111 %
0.472%
70.00
0.059500
27.00
3.00
41.40
0.81
0.18
4.17
6.24
Metal Layer
Metal Layer
Metal Layer
0.022950
0.002550
4.783460
1.980352
0.038746
0.008610
0.199470
0.298488
26.575%
33.30
13.90
95.50
4.00
0.50
1.592892
0.664901
1.624710
1.551598
0.064988
0.008124
9.026 %
PK185 (v1.0) September 21, 2006
www.xilinx.com
© 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.