PK184 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 18.49 g

PK184 (v1.1) May 28, 2008
100% Material Declaration
Data Sheet
BF957
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Chromium
Silica and other filler
materials
Polymetric Resin
Silane compound
Copper
Nickel
Gold
Glass Fiber
Halogen Fire
Retardant
BT (core)
Solder Mask
Tin
Lead
CAS# or
Description
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-47-3
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7439-92-1
% of
Component
100.00
63.00
37.00
70.00
20.00
3.00
7.00
98.00
2.00
Average Weight: 18.49 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.695
0.695
0.009
0.006
0.003
0.071
0.050
0.014
0.002
0.005
11.000
10.780
0.220
0.085
Component %
of Total
3.76%
0.05%
0.38%
59.49%
0.460%
70.00
0.060
27.00
3.00
41.40
0.81
0.18
4.17
6.24
Metal Layer
Metal Layer
Metal Layer
0.023
0.002
4.784
1.980
0.038
0.008
0.200
0.300
25.87%
33.30
13.90
63.00
37.00
1.593
0.665
1.847
1.164
0.683
9.988%
PK184 (v1.1) May 28, 2008
www.xilinx.com
1
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