PK183 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.95g

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PK183 (v1.0.2) December 12, 2008
100% Material Declaration Data Sheet:
FG484
Component
Substance
Description
Silicon Die
Silicon
Die Attach Material
Polymetric Resin
Diester Resin
Acrylate Resin
Silver
Mold Compound
SiO2 Filler
Epoxy Resin A
Epoxy Resin B
Phenol Resin A
Phenol Resin B
Metal Hydroxide
Carbon Black
Substrate
Copper
Nickel
Gold
Glass Fiber (GF)
Halogen Fire
Retardant
BT (core)
Solder Mask (EP)
Gold Wire
Gold
Solder Balls
Tin
Lead
CAS Number
or
Description
7440-21-3
Trade Secret
Trade Secret
Trade Secret
7440-22-4
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-57-5
7440-31-5
7439-92-1
Percentage of
Component
100.00
3.00
20.00
7.00
70.00
86.20
3.00
3.00
3.00
3.00
1.50
0.30
46.27
0.60
0.13
23.00
3.20
16.80
10.00
100.00
63.00
37.00
Use in
Product
Filler
Metal Layer
Metal Layer
Metal Layer
Average Weight: 1.95g
Component Weight/
Substance Weight
(Grams)
Component
Percent of Total
0.04944
2.54%
0.04944
0.00792
0.41%
0.00023766
0.00158440
0.00055454
0.00554540
0.00175
0.09%
0.00150850
0.00005250
0.00005250
0.00005250
0.00005250
0.00002625
0.00000525
1.47070
75.42%
0.68049289
0.00882420
0.00191191
0.33826100
0.04706240
0.24707760
0.14707000
0.01587
0.01587
0.40432
0.2547216
0.1495984
0.81%
20.73%
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trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.
PK183 (v1.0.2) December 12, 2008
www.xilinx.com
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