PK176 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.543 g

PK176 (v2.0) February 12, 2008
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
(adhesive)
Encapsulation
Leadframe
Bond Wire
Ext. Plating
Silicon
Aluminum
Silver
Bismaleimide
polymer
Epoxy resin(EP)
Epoxy Resin (EP)
Silica
Phenol Resin
Copper
Iron
Zinc
Phosphorus
Silver
Gold
Tin
Lead
7440-21-3
7429-90-5
7440-22-4
13676-54-5
29690-82-2
85954-11-6
60676-86-0
205830-20-2
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
7440-57-5
7440-31-5
7439-92-1
100% Material Declaration
Data Sheet
VO48
Material Declaration Data Sheet
% of
Component
99.60
0.40
Average Weight: 0.543 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.017912
0.01784
0.000072
0.00843
Component %
of Total
3.29%
1.55%
77.00
14.00
9.00
7.00
89.00
5.00
97.00
2.00
0.1
0.03
0.2
100.00
85.00
15.00
0.00629
0.0014
0.00074
0.41782
0.02716
0.37186
0.0188
0.09533
0.09272
0.00228
0.00011
0.00003
0.00019
0.00076
0.00076
0.00314
0.00267
0.00047
76.94%
17.55%
0.14%
0.57%
PK176 (v2.0) February 12, 2008
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