PK175 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.2251 g

PK175 (v1.0) October 5, 2006
100% Material Declaration
Data Sheet
VO20
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
7440-21-3
Silver
Epoxy (EP)
7440-22-4
Trade Secret
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Bismuth
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Copper
Iron
Phosphorus
Zinc
7440-50-8
7439-89-6
7723-14-0
7440-66-6
Silver
Gold
Silver
Calcium
Tin
Lead
7440-22-4
7440-57-5
7440-22-4
7440-70-2
7440-31-5
7439-92-1
% of
Component
100.00
Use in Product
Average Weight: 0.1 g
Component Weight/
Substance Weight
(in grams)
0.00999
0.00999
0.0026
Component %
of Total
9.99%
2.60%
77.00
23.00
0.002002
0.000598
0.04918
49.18%
9.00
7.00
0.50
82.50
Max 1.00
97.50
2.35
0.03
0.12
0.0044262
0.0034426
0.0002459
0.0405735
0.0004918
0.035
0.034125
0.0008225
0.0000105
0.000042
0.00008
35.00%
0.08%
100.00
99.9973
0.0005
0.0022
85.00
15.00
0.00008
0.00053
0.00052998569
0.00000000265
0.00000001166
0.00262
0.002227
0.000393
0.53%
2.62%
PK175 (v1.0) October 5, 2006
www.xilinx.com
1
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