PK174 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.524 g

PK174 (v1.1) February 20, 2007
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Encapsulation
Leadframe
Bond Wire
Ext. Plating
Silicon
Al
Epoxy resin(EP)
Silver
Resin
SiO2 Filler
Iron
Nickel
Gold
Tin
Lead
7440-21-3
7429-90-5
29690-82-2
7440-22-4
29690-82-2
60676-86-0
7439-89-6
7440-02-0
7440-57-5
7440-31-5
7439-92-1
100% Material Declaration
Data Sheet
VO8
Material Declaration Data Sheet
% of
Component
99.00
1.00
Average Weight: 0.524 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.0127
0.0126
0.0001
0.0028
Component %
of Total
2.43%
0.54%
25.00
75.00
26.00
74.00
58.00
42.00
100.00
85.00
15.00
0.0007
0.0021
0.3443
0.0913
0.253
0.1552
0.090
0.0652
0.0007
0.0007
0.0078
0.0066
0.0012
65.76%
29.65%
0.13%
1.49%
PK174 (v1.1) February 20, 2007
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