PK172 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.2678 g

PK172 (v1.6) April 26, 2013
100% Material Declaration Data Sheet for VQ64
Package
Component
Silicon Die
Die Attach
Mold
Compound
Leadframe
Solder Plating
Gold Wire
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon (Si)
7440-21-3
Silver (Ag)
Epoxy Resin
Anhydride
1,4-
Butanedioldiglycid
yl ether
7440-22-4
Trade Secret
Trade Secret
2425-79-8
Epoxy Resin
Phenol Resin
Carbon Black
Fused Silica
Trade secret
Trade secret
1333-86-4
60676-86-0
Copper (Cu)
Chromium (Cr)
Tin (Sn)
Zinc (Zn)
Silver (Ag)
Tin (Sn)
Lead (Pb)
Gold (Au)
Palladium
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7440-31-5
7439-92-1
7440-57-5
7440-05-3
100.00
72.00
15.00
10.00
3.00
7.00
5.00
0.30
87.70
98.28
0.25
0.25
0.22
1.00
85.00
15.00
99.00
1.00
Average Weight: 0.2678 g
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
0.005730
0.005730
0.001256
0.000904
0.000189
0.000126
2.140
0.469
0.000038
0.177850
0.012450
0.008893
0.000534
0.155974
0.077400
0.076069
0.000194
0.000194
0.000170
0.000774
0.003780
0.003213
0.000567
0.001790
0.001772
0.000018
66.410
28.902
1.411
0.668
© Copyright 2006-2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK172 (v1.6) April 26, 2013
www.xilinx.com
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