PK170 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.776259 g

PK170 (v1.2) October 5, 2006
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Bond Wire
Ext. Plating
Silicon
anhydride
Silver
Epoxy resin
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Copper
Magnesium
Nickel
Silicon
Gold
Tin
Lead
100% Material Declaration
Data Sheet
TQ176
Material Declaration Data Sheet
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 1.776259 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.02752
0.02752
0.003709
Component %
of Total
1.55%
0.21%
Trade Secret
7440-22-4
Trade Secret
7.50
77.50
15.00
0.000278175
0.002874475
0.00055635
1.465
82.48%
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7.00
5.00
0.30
87.70
7440-50-8
94.3
7439-95-4
0.30
7440-02-0
1.2
7440-21-3
4.2
7440-57-5
100.00
7440-31-5
7439-92-1
85.00
15.00
0.10255
0.07325
0.004395
1.284805
0.2601
0.2452743
0.0007803
0.0031212
0.0109242
0.00393
0.00393
0.016
0.0136
0.0024
14.64%
0.22%
0.90%
PK170 (v1.2) October 5, 2006
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Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.