PK169 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.28 g

PK169 (v1.2) October 3, 2006
Component
Substance
Description
Silicon Die
Die Attach
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
External
Plating
Silicon
Silver
Epoxy (EP)
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Bismuth
Copper
Chromium
Tin
Zinc
Silver
Gold
Tin
Lead
100% Material Declaration
Data Sheet
TQ144
Material Declaration Data Sheet
CAS# or
Description
% of
Component
7440-21-3
7440-22-4
Trade Secret
100.00
78.00
22.00
Use in Product
Average Weight: 1.28 g
Component Weight/
Substance Weight
(in grams)
0.01344
0.01344
0.002048
0.00159744
0.00045056
1.007616
Component %
of Total
1.05 %
0.16 %
78.72 %
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
9.00
7.00
0.50
82.50
Max. 1.00%
Resin
7440-50-8
7440-47-3
7440-31-5
7440-66-6
98.85
0.30
0.25
0.60
0.09068544
0.07053312
0.00503808
0.8312832
0.01007616
0.238848
0.236101248
0.000716544
0.00059712
0.001433088
0.001024
18.66 %
0.08%
7440-22-4
7440-57-5
100.00
100.00
0.001024
0.005632
0.005632
0.011392
0.44 %
0.89 %
7440-31-5
7439-92-1
85.00
15.00
0.0096832
0.0017088
PK169 (v1.2) October 3, 2006
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