PK168 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.7000g

PK168 (v1.3) January 24,
2013
100% Material Declaration Data Sheet for TQ100
Package
Component
Silicon Die
Die Attach
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
External
Plating
Substance
Description
Silicon
Silver
Epoxy (EP)
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Bismuth
Copper
Chromium
Tin
Zinc
Silver
Gold
Tin
Lead
CAS Number or Percentage of
Description
Component
7440-21-3
100.00
7440-22-4
Trade Secret
78.00
22.00
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
9.00
7.00
0.50
82.50
Max. 1.00%
7440-50-8
7440-47-3
7440-31-5
7440-66-6
98.85
0.30
0.25
0.60
7440-22-4
100.00
7440-57-5
7440-31-5
7439-92-1
100.00
85.00
15.00
Average Weight: 0.7000g
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
Resin
0.037870
0.037870
0.005040
0.003931
0.001109
0.463960
0.041756
0.032477
0.002320
0.382767
0.004640
0.178850
0.176793
0.000537
0.000447
0.001073
0.004550
0.004550
0.003570
0.003570
0.006160
0.005236
0.000924
5.41
0.72
66.28
25.55
0.65
0.51
0.88
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and other countries. All other trademarks are the property of their respective owners
PK168 (v1.3) January 24, 2013
www.xilinx.com
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