PK165 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 5.8 g

PK165 (v1.2.1) October 19, 2006
100% Material Declaration
Data Sheet
PQ160
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
Silver
Epoxy (EP)
Epoxy Resin (EP)
Phenolic Resin
Carbon Black
Silica
Bismuth
Copper
Chromium
Tin
Zinc
Silver
Gold
Tin
Lead
CAS# or
Description
7440-21-3
% of
Component
100.00
Use in Product
Average Weight: 5.8 g
Component Weight/
Substance Weight
(in grams)
0.07366
0.07366
0.00928
Component %
of Total
1.27%
0.16%
7440-22-4
Trade Secret
78.00
22.00
0.0072384
0.0020416
4.92304
84.88%
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
9.00
7.00
0.50
82.50
Max 1.00
7440-50-8
7440-47-3
7440-31-5
7440-66-6
98.85
0.30
0.25
0.60
0.4430736
0.3446128
0.0246152
4.061508
0.0492304
0.73486
0.72640911
0.00220458
0.00183715
0.00440916
0.00638
12.67%
0.11%
7440-22-4
7440-57-5
7440-31-5
7439-92-1
100.00
100.00
85.00
15.00
0.00638
0.01392
0.01392
0.03886
0.033031
0.005829
0.24%
0.67 %
PK165 (v1.2.1) October 19, 2006
www.xilinx.com
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