PK162 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 10.943 g

PK162 (v1.2) October 3, 2006
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Heat Sink
Ext. Heat Sink
Plating
Bond Wire
Ext. Plating
Silicon
Resin
Silver
Epoxy Resin (EP)
Silica
Copper
Chromium
Tin
Zinc
Silver
Copper
Nickel
Gold
Palladium
Tin
Lead
100% Material Declaration
Data Sheet
HQ208
Material Declaration Data Sheet
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 10.943 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.16981
0.169814
0.01531
Component %
of Total
1.55%
0.14%
Trade Secret
7440-22-4
25.00
75.00
0.003828
0.011483
3.24216
29.63%
Trade Secret
60676-86-0
7440-50-8
7440-47-3
7440-31-5
7440-66-6
16.00
84.00
99.25
0.30
0.25
0.20
0.518746
2.723414
0.37676
0.373939
0.001130
0.000942
0.000754
0.001560
3.44%
0.01%
7440-22-4
7440-50-8
100.00
100.00
0.001560
7.08725
7.08725
0.00547
64.76%
0.05%
7440-02-0
7440-57-5
7440-05-3
7440-31-5
7439-92-1
100.00
99.05
0.9500
85.00
15.00
0.005471
0.01153
0.01142
0.00011
0.03346
0.028441
0.005019
0.11%
0.31%
PK162 (v1.2) October 3, 2006
www.xilinx.com
1
© 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.