PK160 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 7.248 g

PK160 (v1.2) October 5, 2006
100% Material Declaration
Data Sheet
PC84
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
7440-21-3
Resin
Trade Secret
Silver
7440-22-4
Zirconium
Trade Secret
Mixed aryl allyl
glycidyl compounds
Trade Secret
Amine
Trade Secret
Gamma Butyrolaclone Trade Secret
Diglycidylether of
bisphenol-F
Trade Secret
Epoxy Resin (EP)
Trade Secret
Silica
60676-86-0
Carbon Black
1333-86-4
Epoxy Cresol Novolac Trade Secret
Phenolic Resin
Trade Secret
Copper
Zirconium
7440-50-8
7440-67-7
Silver
Gold
Tin
Lead
7440-22-4
7440-57-5
7440-31-5
7439-92-1
% of
Component
100.00
7.00
70.00
0.10
3.00
5.00
5.00
10.00
7.50
86.00
0.50
2.00
4.00
99.90
0.10
100.00
100.00
85.00
15.00
Average Weight: 7.248 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.02369
0.023688
0.00377
Component %
of Total
0.33%
0.05%
0.000264
0.002640
0.001252
0.000113
0.000189
0.000189
0.000377
5.91943
81.67%
0.443957
5.090706
0.029597
0.118389
0.23677
1.25241
1.251153
0.001252
0.00254
17.28%
0.04%
0.002544
0.00348
0.00348
0.04241
0.0360485
0.0063615
0.05%
0.58%
PK160 (v1.2) October 5, 2006
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