PK159 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.360 g

PK159 (v1.2) September 29, 2006
100% Material Declaration
Data Sheet
PC44
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Leadframe
Leadframe
Plating
Bond Wire
Ext. Plating
Silicon
7440-21-3
Resin
Silver
Trade Secret
7440-22-4
Epoxy Resin (EP)
Trade Secret
Silica
60676-86-0
Carbon Black
1333-86-4
Epoxy Cresol Novolac Trade Secret
Phenolic Resin
Trade Secret
Copper
Zirconium
7440-50-8
7440-67-7
Silver
Gold
Tin
Lead
7440-22-4
7440-57-5
7440-31-5
7439-92-1
% of
Component
100%
25.00
75.00
7.50
86.00
0.50
2.00
4.00
99.90
0.10
100.00
100.00
85.00
15.00
Average Weight: 2.360 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.00764
0.007637
0.00199
Component %
of Total
0.32%
0.08%
0.000498
0.001494
1.82599
77.38%
0.0136949
1.570352
0.009130
0.036520
0.073040
0.49849
0.497994
0.000498
0.00149
21.13%
0.06%
0.00182
0.001818
0.02221
0.0188785
0.0033315
0.08%
0.94%
PK159 (v1.2) September 29, 2006
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