PK157 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 10.904 g

PK157 (v1.2) September 25, 2006
100% Material Declaration
Data Sheet
FG860
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Laminate
Heat Sink
Heat Snk
Plating
Dam
Bond Wire
Solder Balls
Silicon
Silver
Resin
Epoxy Resins
SiO2
Laminate
Solder Mask
Copper
Nickel
Gold
Copper
Iron
Phosphorus
Zinc
Nickel
Epoxy Resin
Gold
Tin
Lead
PK157 (v1.2) September 25, 2006
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 10.904 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.1201
0.1201
0.012
Component %
of Total
1.10%
0.11%
7440-22-4
Trade Secret
75.00
25.00
0.009
0.003
0.4135
7.31%
Trade Secret
60676-86-0
Trade Secret
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-50-8
7439-89-6
7723-14-0
7440-66-6
26.00
74.00
Filler
Metal Layer
Metal Layer
Metal Layer
97.50
2.35
0.003
0.12
0.207
0.590
0.7897
0.481
0.168
0.122
0.014
0.005
7.0645
6.888
0.166
0.0002
0.008
0.3292
7.24%
64.79%
3.02%
7440-05-0
100.00
Trade Secret
100.00
7440-57-5
100.00
7440-31-5
7439-92-1
63.00
37.00
www.xilinx.com
0.3292
0.0148
0.0.148
0.0236
0.0236
1.752
1.104
0.648
0.13%
0.22%
16.07%
1
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