PK151 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.9408 g

PK151 (v1.2) September 14, 2006
100% Material Declaration
Data Sheet
FG256
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Laminate
Bond Wire
Solder Balls
Silicon
Silver
Resin
Epoxy Resins
SiO2
Laminate
Solder Mask
Copper
Nickel
Gold
Gold
Silver
Copper
Iron
Calcium
Palladium
Magnesium
Tin
Lead
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 0.9408 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.0749
0.0749
0.0074
Component %
of Total
7.97%
0.78%
7440-22-4
Trade Secret
78.00
22.00
0.0058
0.0016
0.3748
39.84%
Trade Secret
60676-86-0
Trade Secret
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-57-5
7440-22-4
7440-50-8
7439-89-6
7440-70-2
7440-05-3
7439-95-4
7440-31-5
7439-92-1
12.00
88.00
Filler
61.00
17.36
16.00
4.80
0.84
Metal Layer
Metal Layer
Metal Layer
99.00
0.0025
0.0005
0.0005
0.0020
0.9900
0.0005
63.00
37.00
0.0450
0.3298
0.2085
0.1272
0.0362
0.0334
0.0100
0.0018
0.0043
0.004263581
0.000000108
0.000000022
0.000000022
0.000000086
0.000042636
0.000000022
0.2709
0.170667
0.100233
22.16%
0.46%
28.79%
PK151 (v1.2) September 14, 2006
www.xilinx.com
1
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