PK150 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.1 g

PK150 (v1.2) September 29, 2006
100% Material Declaration
Data Sheet
FS48
Material Declaration Data Sheet
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Encapsulant
Laminate
Bond Wire
Solder Balls
Silicon
7440-21-3
Silver
Epoxy Resin
7440-22-4
29690-82-2
Epoxy
Carbon Black
Silica
Antimony Trioxide
Brominated Flame
Retardant (TBBA)
29690-82-2
1333-86-4
60676-86-0
1309-64-4
79-94-7
Bismaleimide/Triazine
Board
Copper
Nickel
Gold
Resist
Brominated Flame
Retardant (TBBA)
13676-54-
5/25722-66-1
7440-50-8
7440-02-0
7440-57-5
Trade Secret
79-94-7
Gold
7440-57-5
Tin
Lead
7440-31-5
7439-92-1
% of
Component
Use in Product
100.00
75.00
25.00
Filler
26.50
0.50
70.00
2.00
1.00
Flame Retardant
69.00
20.00
0.80
0.20
9.00
1.00
Metal Layer
Metal Layer
Metal Layer
Flame Retardant
100.00
63.00
37.00
Average Weight: 0.1 g
Component Weight/
Substance Weight
(in grams)
0.0059
0.0059
0.00205
Component %
of Total
5.90 %
2.05%
0.0015375
0.0005125
0.04265
0.01130225
0.00021325
0.029855
0.000853
0.0004265
42.65 %
0.03525
0.0243225
35.25 %
0.00705
0.000282
0.0000705
0.0031725
0.0003525
0.00095
0.00095
0.0132
0.008316
0.004884
0.95%
13.20 %
PK150 (v1.2) September 29, 2006
www.xilinx.com
1
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