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PK149 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.3 g
PK149 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
CS144
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Encapsulant
Tape
Metal Layers
Bond Wire
Solder Balls
Silicon
Silver
Resin (EP)
Epoxy Resins
Phenolic Resins
Carbon Black
Silica
Bismuth
Metal Hydroxide
Polymide
Adhesive
Copper
Nickel
Gold
Gold
Tin
Lead
CAS# or
Description
7440-21-3
% of
Component
100.00
Use in Product
Average Weight: 0.3 g
Component Weight/
Substance Weight
(in grams)
0.01818
0.01818
0.00099
Component %
of Total
6.06%
0.33%
7440-22-4
Trade Secret
52.00
48.00
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Trade Secret
6.00
6.00
0.50
84.00
Max 1.00
2.50
Color
Trade Secret
Trade Secret
41.51
58.49
7440-50-8
7440-02-0
7440-57-5
88.32
7.90
3.78
7440-57-5
100.00
7440-31-5
7439-92-1
63.00
37.00
0.0005148
0.0004752
0.15591
0.0093546
0.0093546
0.00077955
0.1309644
0.0015591
0.00389775
0.01794
0.007446894
0.010493106
0.03285
0.02901312
0.00259515
0.00124173
0.00261
0.00261
0.07152
0.0450576
0.0264624
51.97%
5.98%
10.95%
0.87%
23.84%
PK149 (v1.2) September 28, 2006
www.xilinx.com
1
© 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
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Xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.