PK148 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.2 g

PK148 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
CS48
Material Declaration Data Sheet
Component
Silicon Die
Die Attach
Material
Encapsulant
Laminate
Bond Wire
Solder Balls
Substance
Description
CAS# or
Description
Silicon
7440-21-3
Silver
Resin (EP)
7440-22-4
Trade Secret
Epoxy Resins
Phenolic Resins
Carbon Black
SiO2 Filler
Bismuth
Metal Hydroxide
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7440-69-9
Trade Secret
Bismaleimide/Triazin
e Board
Copper
Nickel
Gold
Antimony Pentoxide
Brominated Resin
13676-54-5 /
25722-66-1
7440-50-8
7440-02-0
7440-57-5
1314-60-9
68541-56-0
Gold
7440-57-5
Tin
Lead
7440-31-5
7439-92-1
% of
Component
100.00
78.00
22.00
6.00
6.00
0.50
84.00
Max 1.00
2.50
72.685
9.880
7.270
1.160
0.005
9.000
100.00
63.00
37.00
Use in Product
Average Weight: 0.2 g
Component Weight/
Substance Weight
(in grams)
0.00562
0.00562
0.0018
Component %
of Total
2.81%
0.59%
0.001404
0.000396
0.0947
0.005682
0.005682
0.0004735
0.079548
0.000947
0.0023675
0.0301
0.021878185
47.35%
15.05%
0.00297388
0.00218827
0.00034916
0.000001505
0.002709
0.00036
0.00036
0.06804
0.0428652
0.0251748
0.18%
34.02%
PK148 (v1.2) September 28, 2006
www.xilinx.com
1
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