PK146 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.1 g

PK146 (v1.2) September 28, 2006
100% Material Declaration
Data Sheet
CP56
Material Declaration Data Sheet
Component
Silicon Die
Die Attach
Material
Encapsulant
Laminate
Bond Wire
Solder Balls
Substance
Description
CAS# or
Description
Silicon
7440-21-3
Silver
Resin
7440-22-4
Trade Secret
Epoxy Resin
Phenolic Resin
Carbon Black
Bismuth
SiO2 Filler
Trade Secret
Trade Secret
1333-86-4
7440-69-9
60676-86-0
Bismaleimide /
Triazine Board
Copper
Nickel
Gold
Antimony Pentoxide
Brominated Resin
13676-54-5 /
25722-66-1
7440-50-8
7440-02-0
7440-57-5
1314-60-9
68541-56-0
Gold
7440-57-5
Tin
Lead
7440-31-5
7439-92-1
% of
Component
Use in Product
100.00
78.00
22.00
6.00
6.00
0.50
Max 1.00
86.50
72.285
9.780
7.890
1.140
0.005
8.90
Metal Layer
Metal Layer
Metal Layer
Flame Retardant
Flame Retardant
100.00
63.00
37.00
Average Weight: 0.1 g
Component Weight/
Substance Weight
(in grams)
0.00215
0.00215
0.0005
Component %
of Total
2.15%
0.50%
0.00039
0.00011
0.03956
0.0023736
0.0023736
39.56%
0.0003956
0.0342194
0.0126
0.00910791
12.60%
0.00123228
0.00099414
0.00014364
0.00000063
0.0011214
0.00023
0.00023
0.04496
0.0283248
0.0166352
0.23%
44.96%
PK146 (v1.2) September 28, 2006
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