PK143 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.599 g

PK143 (v1.2.1) January 8, 2007
100% Material Declaration
Data Sheet
BG225
Material Declaration Data Sheet
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold
Compound
Laminate
Gold Wire
Solder Balls
Silicon
Resin
Silver
Resin
Silica
Laminate
Solder Mask (EP)
Copper
Nickel
Gold
Gold
Tin
Lead
CAS# or
Description
7440-21-3
% of
Component
100.00
Average Weight: 2.599 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.0735
0.0735
0.0073
Component %
of Total
2.83%
0.28%
Trade Secret
7440-22-4
22.00
78.00
0.0016
0.0057
1.0846
41.73%
Trade Secret
60676-86-0
Trade Secret
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-57-5
7440-31-5
7439-92-1
12.00
88.00
Filler
Metal Layer
Metal Layer
Metal Layer
Metal Layer
100.00
63.00
37.00
0.1302
0.9544
1.1403
0.5613
0.0878
0.4662
0.0209
0.0041
0.0117
0.0118
0.2816
0.1774
0.1042
43.87%
0.45%
10.83%
PK143 (v1.2.1) January 8, 2007
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