PK141 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 18.7326g

PK141 (v1.2) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Organopolysiloxane
mixture
Copper
Nickel
Gold
Glass fiber
Halogen fire
retardant
BT (core)
Solder mask
Tin
Lead
100% Material Declaration Data Sheet
FF1704
CAS Number
or
Description
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
N/A
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7439-92-1
Percentage of
Component
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.90
0.10
100.00
Average Weight: 18.7326g
Use in
Product
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
1.187220
6.338
1.187220
0.021443
0.114
0.013509
0.007934
0.135000
0.721
0.094500
0.027000
0.004050
0.009450
13.300000
70.999
13.286700
0.013300
0.125800
0.672
0.125800
47.61
0.51
0.11
10.35
5.25
Metal layer
Metal layer
Metal layer
Flame retardant
2.353223
1.120381
0.012002
0.002589
0.243561
0.123451
12.562
27.54
8.63
63.00
37.00
0.648155
0.203085
1.423460
1.014247
0.595669
8.594
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countries. All other trademarks are the property of their respective owners.
PK141 (v1.2) July 20, 2010
www.xilinx.com
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