PK140 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 21.0g

PK140 (v1.2) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Spreader
Heat Spreader
Adhesive
Laminate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Silane compound
Filler materials
Polymeric resin
Copper
Nickel
Gold
Glass fiber
Halogen fire
retardant
BT (core)
Solder mask
Tin
Lead
100% Material Declaration Data Sheet
FF1696
CAS Number
or
Description
Percentage of
Component
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7439-92-1
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.90
0.10
70.00
27.90
3.00
47.61
0.51
0.11
10.35
5.25
27.54
8.63
63.00
37.00
Use in
Product
Filler
Metal layer
Metal layer
Metal layer
Average Weight: 21.0g
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
1.187223
5.655
1.187223
0.008333
0.040
0.00520
0.003083
0.147000
0.700
0.102900
0.029400
0.004410
0.010290
13.300000
63.352
13.286700
0.013300
0.085000
0.405
0.059500
0.022950
0.002550
4.652150
22.159
2.214911
0.0233726
0.005117
0.481502
0.244054
1.281355
0.401485
1.614250
1.016978
0.597273
7.689
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PK140 (v1.2) July 20, 2010
www.xilinx.com
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