PK137 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 14.0g

PK137 (v1.3) July 20, 2010
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Heat Sink
Heat Sink
Adhesive
Substrate
Solder Balls
Silicon
Tin
Lead
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
Copper
Nickel
Organopolysiloxane
mixture
Copper
Nickel
Gold
Glass fiber
BT (core)
Halogen fire
retardant
Solder mask
Tin
Lead
100% Material Declaration Data Sheet
FF1152
CAS Number
or
Description
Percentage of
Component
7440-21-3
7440-31-5
7439-92-1
60676-86-0
9003-36-5
25068-38-6
19900-65-3
7440-50-8
7440-02-0
NA
100.00
63.00
37.00
70.00
20.00
3.00
7.00
99.97
0.03
100.00
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-31-5
7439-92-1
47.61
0.51
0.11
10.35
27.54
5.25
8.63
63.00
37.00
Use in
Product
Average Weight: 14.0g
Component
Weight/
Substance Weight
(grams)
Component
Percent of Total
0.8848
6.32
0.8848
0.0154
0.11
0.009702
0.005698
0.112
0.80
0.0784
0.0224
0.00336
0.00784
8.3258
59.47
8.32330226
0.00249774
0.0007
0.05
0.0007
Metal layer
Metal layer
Metal layer
3.7156
1.76899716
0.01894956
0.00408716
0.3845646
1.02327624
0.195069
26.54
0.32065628
0.9394
0.591822
0.347578
6.71
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PK137 (v1.3) July 20, 2010
www.xilinx.com
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